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PCB Assembly

Prototype PCB Assembly Services

Get production level prototype PCBs through us, the top PCB assembly China based service. We are here to help you develop your PCB designs through our prototype PCB assembly (PCBA) service aimed at helping large companies develop rapid prototypes and small companies engage in low volume production at low cost.

Automation and compliance

As one of the best PCB assembly services manufacturers, we assure total compliance with regulations and offers fast turnaround times.

  • Fully automated pick and place for SMT and wave soldering
  • Lead-free soldering, ROHS and CE compliant, as well as IPC 610 Class 2 and Class 3 compliant
  • Thorough checks for dry solder and track joins
  • Single to multi-layer prototype PCB assembly

 

Easy process

As the top PCB assembly China based service, we make it easy for you to get prototype or small quantity runs.

  • Get instant quotes by filling out an online form
  • Upload Gerber file and parts list, obtain quote for parts and approve
  • You get trial picture. Confirm and we start prototype PCB assembly

 

You are getting the benefit of the finest, quality focused PCB assembly services manufacturers with all capabilities under one roof and from one source. You do not have to supply parts and components; we source them for you. This goes to show just how much we care for you and are committed to making it easy for you to be competitive.

  • assembly-1

    Smart home main boards PCBA

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-2

    PCBA for Control boards for industry

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-3

    PCBA for interphone main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-4

    Prototype PCB assembly for medical products

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-5

     PCBA for function control main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-6

    PCBA for communication control boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-7

    PCBA for radio frequency main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
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