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PCB Assembly

PCB Assembly Service

We at GREATPCB are capable of meeting the customer demands which are ever-increasing by the day. Hence, our teams are capable enough to provide that is quickly printed and full turn-key switch board that are a part of our PCB assembly services. It includes the sources of component testing design and sourcing.PCB assembly comprises of a specific process that requires teams to possess knowledge not just confined to Pcb assembly china components but also the design of the printed board of circuit, strong understanding for the final product and fabrication of PCB.

A one-stop destination to all your PCB assembly needs

GREATPCB is your one-stop answer to Prototype pcb assembly and all the services related to circuit boards. Hence, we often are entrenched with the entire process of production for Pcb assembly. Through the strong networks we possess, of a circuit assembly that is well-proven and the partners of manufacturing, we provide capabilities for the prototype PCB application of an advanced kind.

If you are looking for Pcb assembly, Pcb assembly in china, PCB Assembly manufacturing, PCB assembly services, PCB manufacturer, Pcb manufacturer in china, Printed circuit board manufacturers, and Prototype pcb assembly, please contact Greatpcb.

  • assembly-1

    Smart home main boards PCBA

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-2

    PCBA for Control boards for industry

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-3

    PCBA for interphone main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-4

    Prototype PCB assembly for medical products

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-5

     PCBA for function control main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-6

    PCBA for communication control boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
  • assembly-7

    PCBA for radio frequency main boards

    1 : Min IC pitch 0.30mm (12mil), 8 BGA
    2 : Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
    3 : Min chip placement 01005
    4 : Max PCB Size 410 x 600mm (16.2 x 23.6″)
    5 : Min PCB thickness 0.35mm (13.8mil)
    6 : Min:BGA ball pitch 1-3mm (4-12mil)
    7 : BGA ball diameter 0.4-1mm (16-40mil)
    8 : QFP lead pitch 0.38-2.54mm (15-100mil)
    9 : packing Anti-static bubble bag and carton
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