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PCB stack-up

PCB stack-up

  • 4 layers Rigid PCB stack up
    Our standard multi-layer PCB stackup is predominantly made up of three components with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores.
  • 4 layers FPC stack-up
    4 layers Flexible circuit boards stack-up , PI ,base copper with or without adhesive,overlay , the thickness is from 0.15mm-0.5mm
  • Blind Vias: Connects an inner layer with the adjacent surface layer, they are only visible on one side of the boards and so are called ‘blind’ vias.

    Buried Vias: Connects two adjacent inner copper layers. They are not visible from the surface and so are ‘buried’.

  • Copper in the wall of PTH: The thickness of copper in the wall of PTH hole as 25 at least.
  • Side Plating
    To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout. Minimum overlap:500mm
    On the connected layer, min 300um of connected copper must be defined.
    On non-connected layers, the copper should have gap of min. 800um from the outer contour.
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