4 layers Rigid PCB stack up
Our standard multi-layer PCB stackup is predominantly made up of three components with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores.
4 layers FPC stack-up
4 layers Flexible circuit boards stack-up , PI ,base copper with or without adhesive,overlay , the thickness is from 0.15mm-0.5mm
Blind Vias: Connects an inner layer with the adjacent surface layer, they are only visible on one side of the boards and so are called ‘blind’ vias.
Buried Vias: Connects two adjacent inner copper layers. They are not visible from the surface and so are ‘buried’.
Copper in the wall of PTH: The thickness of copper in the wall of PTH hole as 25 at least.
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout. Minimum overlap:500mm
On the connected layer, min 300um of connected copper must be defined.
On non-connected layers, the copper should have gap of min. 800um from the outer contour.